Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates
Crossref DOI link: https://doi.org/10.1007/s11665-018-3419-2
Published Online: 2018-05-29
Published Print: 2018-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Soares, D.
Leitão, H.
Lau, C. S.
Teixeira, J. C.
Ribas, L.
Alves, R.
Teixeira, S.
Cerqueira, M. F.
Macedo, F.
Text and Data Mining valid from 2018-05-29
Article History
Received: 24 October 2017
Revised: 27 March 2018
First Online: 29 May 2018