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Effect of Ni Addition to Sn0.7Cu Solder Alloy on Thermal Behavior, Microstructure, and Mechanical Properties

Crossref DOI link: https://doi.org/10.1007/s11665-018-3734-7

Published Online: 2018-11-13

Published Print: 2018-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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