Study of the Electrical and Diffusion Barrier Properties in Ultrathin Carbon Film-Coated Copper Microwires for Interconnects
Crossref DOI link: https://doi.org/10.1007/s11665-019-03976-6
Published Online: 2019-03-15
Published Print: 2019-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chang, Chang-Shuo
Wang, Da-Jiun
Li, Tse-Chang
Shen, Chang-Hong
Jing, Yuan-Chou
Wu, Gien-Huang
Lin, Jen-Fin
Text and Data Mining valid from 2019-03-15
Article History
Received: 26 October 2018
Revised: 26 January 2019
First Online: 15 March 2019