Multi-material Design in the Case of a Coupled Selection of Architectures and Materials: Application to Embedded Electronic Packaging
Crossref DOI link: https://doi.org/10.1007/s11665-019-04437-w
Published Online: 2019-11-25
Published Print: 2019-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Baracchini, Paul
Guillebaud, Claire http://orcid.org/0000-0003-0788-6409
Kromm, François-Xavier
Wargnier, Hervé
Text and Data Mining valid from 2019-11-25
Version of Record valid from 2019-11-25
Article History
Received: 12 April 2019
Revised: 15 October 2019
First Online: 25 November 2019