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Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be Solder Joint during Isothermal Aging

Crossref DOI link: https://doi.org/10.1007/s11665-020-04838-2

Published Online: 2020-05-13

Published Print: 2020-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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