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Enhanced Thermal Conductivity and Tensile Strength of Copper Matrix Composite with Few-Layer Graphene Nanoplates

Crossref DOI link: https://doi.org/10.1007/s11665-021-05902-1

Published Online: 2021-05-28

Published Print: 2021-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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