The Mechanical Properties and Microstructure of Nanostructured Cu with a Flexible Random Distribution of Multimodal Grain Size Prepared by a Combination of Electrodeposition and Recrystallization Annealing
Crossref DOI link: https://doi.org/10.1007/s11665-021-06084-6
Published Online: 2021-08-19
Published Print: 2021-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Linbo
Shen, Xixun
Deng, Chengwei
Wang, Tao
Yun, Hong
Xu, Qunjie
Text and Data Mining valid from 2021-08-19
Version of Record valid from 2021-08-19
Article History
Received: 19 May 2021
Revised: 6 July 2021
Accepted: 16 July 2021
First Online: 19 August 2021