Document is current

Any future updates will be listed below

Microstructure, Mechanical Behavior, and Thermal Conductivity of Three-Dimensionally Interconnected Hexagonal Boron Nitride-Reinforced Cu-Ni Composite

Crossref DOI link: https://doi.org/10.1007/s11665-021-06450-4

Published Online: 2021-11-24

Published Print: 2022-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark