Microstructure and Electrical Resistivity of In Situ Cu-Fe Microcomposites
Crossref DOI link: https://doi.org/10.1007/s11665-021-06485-7
Published Online: 2021-12-02
Published Print: 2022-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Keming
Sheng, Xiaochun
He, Guangyu
Han, Ningle
Li, Mulin
Zhang, Mengcheng
Zou, Jin
Atrens, Andrej
Huang, Huiming
Text and Data Mining valid from 2021-12-02
Version of Record valid from 2021-12-02
Article History
Received: 22 June 2021
Revised: 31 October 2021
Accepted: 17 November 2021
First Online: 2 December 2021