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An Investigation on Microstructure and Mechanical Properties of a Copper Strip Subjected to Different Routes of Accumulative Roll Bonding Process

Crossref DOI link: https://doi.org/10.1007/s11665-022-07145-0

Published Online: 2022-07-26

Published Print: 2023-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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