The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites
Crossref DOI link: https://doi.org/10.1007/s11665-023-07894-6
Published Online: 2023-02-08
Published Print: 2023-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Ruijun
Liu, Jingbo
Wang, Tianshi
Pang, Xiaolu
Xu, Lining
Qiao, Lijie
Text and Data Mining valid from 2023-02-08
Version of Record valid from 2023-02-08
Article History
Received: 25 June 2022
Revised: 22 September 2022
Accepted: 19 January 2023
First Online: 8 February 2023