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Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates

Crossref DOI link: https://doi.org/10.1007/s11665-023-08155-2

Published Online: 2023-04-17

Published Print: 2023-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Dybeł, Aleksandra https://orcid.org/0000-0001-7945-7502
Czaja, Paweł https://orcid.org/0000-0001-5011-9323
Sitek, Janusz https://orcid.org/0000-0001-5028-5305
Pstruś, Janusz https://orcid.org/0000-0001-7910-4299
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Text and Data Mining valid from 2023-04-17

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Article History

Received: 18 November 2022

Revised: 20 February 2023

Accepted: 24 March 2023

First Online: 17 April 2023