Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy
Crossref DOI link: https://doi.org/10.1007/s11665-023-08284-8
Published Online: 2023-05-22
Published Print: 2023-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Czaja, Paweł
Dybeł, Aleksandra
Pstruś, Janusz
Text and Data Mining valid from 2023-05-22
Version of Record valid from 2023-05-22
Article History
Received: 31 December 2022
Revised: 12 April 2023
Accepted: 1 May 2023
First Online: 22 May 2023