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Low-Temperature Die Bonding of SiC Chips with DBC Ceramic Substrates Using High-Density Ag (111) Nanotwinned Films

Crossref DOI link: https://doi.org/10.1007/s11665-023-08441-z

Published Online: 2023-07-05

Published Print: 2024-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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