Thermal Stability and Mechanical Properties of Cu-Nb Nanocomposite Thin Films
Crossref DOI link: https://doi.org/10.1007/s11665-023-08737-0
Published Online: 2023-09-25
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Y. G. http://orcid.org/0000-0002-9913-4011
Chen, H.
Huang, Y. C.
Liu, W. Y.
Text and Data Mining valid from 2023-09-25
Version of Record valid from 2023-09-25
Article History
Received: 15 May 2023
Revised: 11 August 2023
Accepted: 1 September 2023
First Online: 25 September 2023
Conflict of interest
: We declare that we have no conflict of interest.