Effect of Mold Material and Solidification Conditions on Microstructural and Mechanical Properties of Directionally Solidified Sn-0.7Cu Alloy Developed Using Microwave Energy
Crossref DOI link: https://doi.org/10.1007/s11665-024-09732-9
Published Online: 2024-06-21
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Parvej, http://orcid.org/0000-0003-1577-4466
Sharma, Apurbba Kumar http://orcid.org/0000-0001-9783-1000
Text and Data Mining valid from 2024-06-21
Version of Record valid from 2024-06-21
Article History
Received: 1 November 2023
Revised: 1 March 2024
Accepted: 9 May 2024
First Online: 21 June 2024