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Research on the Thermal Stability of MoCu/CoSb3 Thermoelectric Junction with CoCrFeNi High-Entropy Alloy Barrier Layer

Crossref DOI link: https://doi.org/10.1007/s11665-024-10237-8

Published Online: 2024-11-05

Published Print: 2025-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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