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Cross-Correlation of Interconnection Technologies—A Case Study of Reduced Wire Bond Quality after Ultrasonic Welding

Published Online: 2024-11-06

Published Print: 2025-03

Authors

Groth, A.

Hempel, M.
Funding

Funding for this research was provided by:

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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Text and Data Mining valid from 2024-11-06

Version of Record valid from 2024-11-06
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Article History

Received: 1 March 2024

Revised: 14 July 2024

Accepted: 6 September 2024

First Online: 6 November 2024

Document is current