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Enhanced Bonding of Immiscible Mg/Ta Systems via Cu-Interlayer-Assisted Two-Step Thermomechanical Processing

Crossref DOI link: https://doi.org/10.1007/s11665-026-13188-4

Published Online: 2026-01-20

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yu, Zhilei

Li, Jingli

Xue, Zhiyong
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Text and Data Mining valid from 2026-01-20

Version of Record valid from 2026-01-20
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Article History

Received: 17 October 2025

Revised: 18 December 2025

Accepted: 1 January 2026

First Online: 20 January 2026