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Multi-field Coupling Analysis of the High-Temperature Ultrasonic Embossing Process

Published Online: 2026-02-10

Published Print: 2026-06

Authors

Huang, Zhijian

Zhou, Zhangfeng

Meng, Zhen

Huang, Xianle

Liu, Xiangqi
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Text and Data Mining valid from 2026-02-10

Version of Record valid from 2026-02-10
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Article History

Received: 26 June 2025

Accepted: 7 January 2026

First Online: 10 February 2026

Competing interests

: The authors have no relevant financial or non-financial interests to disclose.

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