Response and Deformation Behavior of Cu-Pb-Sn Alloys with Different Microstructures to U-Type Die Bending Loads
Crossref DOI link: https://doi.org/10.1007/s11665-026-13610-x
Published Online: 2026-03-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Xiaowen
Wang, Mingfei
Tao, Meiyue
Tian, Guo
Jiang, Na
Su, Tiexiang
Peng, Bo
Li, Tingju
Jie, Jinchuan
Text and Data Mining valid from 2026-03-09
Version of Record valid from 2026-03-09
Article History
Received: 14 November 2025
Revised: 1 February 2026
Accepted: 23 February 2026
First Online: 9 March 2026