Quantitative Analysis of the Relationship Between Microstructures and Thermal Conductivity for YSZ Coatings
Crossref DOI link: https://doi.org/10.1007/s11666-017-0542-9
Published Online: 2017-03-17
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Ning
Song, Xuemei
Liu, Ziwei
Lin, Chucheng
Zeng, Yi
Huang, Liping
Zheng, Xuebing
License valid from 2017-03-17