Narrow and Thin Copper Linear Pattern Deposited by Vacuum Cold Spraying and Deposition Behavior Simulation
Crossref DOI link: https://doi.org/10.1007/s11666-020-01102-w
Published Online: 2020-10-08
Published Print: 2021-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ma, Kai
Li, Chang-Jiu
Li, Cheng-Xin
Text and Data Mining valid from 2020-10-08
Version of Record valid from 2020-10-08
Article History
Received: 15 April 2020
Revised: 21 August 2020
Accepted: 13 September 2020
First Online: 8 October 2020