Failure Analysis of Micro Cracks and Alumina Inclusions Induced Insulator Pin’s Low Stress Mode of Fracture
Crossref DOI link: https://doi.org/10.1007/s11668-015-9970-3
Published Online: 2015-07-08
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Qiangyun
Zhao, Hui
Chai, Wuqian
Yang, Chuan
Text and Data Mining valid from 2015-07-08