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Enhancing Ball Grid Array (BGA) Component on Printed Circuit Board (PCB) Solder Joint Integrity with Antimony Element

Published Online: 2025-04-10

Published Print: 2025-04

Authors

Jalar, Azman

Lim, Ee May

Abu Bakar, Maria

Ismail, Adlil Aizat

Che Ani, Fakhrozi

Tan, Choo Par
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Text and Data Mining valid from 2025-04-01

Version of Record valid from 2025-04-01
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Article History

Received: 4 February 2025

Accepted: 16 March 2025

First Online: 10 April 2025

Document is current