Document is current

Any future updates will be listed below

Optimizations and Case Studies: Decapsulation of Hardened Epoxy SiC MOSFETs and Diodes via JIACO Microwave-Induced Plasma Etching

Crossref DOI link: https://doi.org/10.1007/s11668-025-02266-9

Published Online: 2025-08-25

Published Print: 2025-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark