Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging
Crossref DOI link: https://doi.org/10.1007/s11669-016-0475-x
Published Online: 2016-06-16
Published Print: 2016-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Attari, Vahid
Arroyave, Raymundo
License valid from 2016-06-16