Interdiffusion and Atomic Mobilities in bcc Ti-Ga and Ti-Cu Alloys
Crossref DOI link: https://doi.org/10.1007/s11669-016-0506-7
Published Online: 2017-02-15
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, C. P.
Luo, Y. S.
Lu, Y.
Han, J. J.
Shi, Z.
Guo, Y. H.
Liu, X. J.
License valid from 2017-02-15