Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range
Crossref DOI link: https://doi.org/10.1007/s11669-017-0532-0
Published Online: 2017-03-10
Published Print: 2017-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yakymovych, A. http://orcid.org/0000-0002-2884-9984
Plevachuk, Yu.
Sklyarchuk, V.
Sokoliuk, B.
Galya, T.
Ipser, H.
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