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Pseudo-structural Transition and Thermal Stress-Induced Microcracking in the NdCu Intermetallic

Crossref DOI link: https://doi.org/10.1007/s11669-022-01020-0

Published Online: 2022-12-29

Published Print: 2023-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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