Temperature-regulating materials for advanced food packaging applications: a review
Crossref DOI link: https://doi.org/10.1007/s11694-017-9672-5
Published Online: 2017-10-24
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Singh, Suman
Gaikwad, Kirtiraj K.
Lee, Myungho
Lee, Youn Suk
License valid from 2017-10-24