Modelling of void healing in hot rolling due to recrystallization
Crossref DOI link: https://doi.org/10.1007/s11740-019-00938-8
Published Online: 2019-11-30
Published Print: 2020-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Xinyang http://orcid.org/0000-0001-7886-5758
Liebsch, Conrad
Hirt, Gerhard
Lohmar, Johannes
Funding for this research was provided by:
Deutsche Forschungsgemeinschaft (278868966)
Text and Data Mining valid from 2019-11-30
Version of Record valid from 2019-11-30
Article History
Received: 1 August 2019
Accepted: 18 November 2019
First Online: 30 November 2019