Effects of thermal transport properties on temperature distribution within silicon wafer
Crossref DOI link: https://doi.org/10.1007/s11771-014-2078-1
Published Online: 2014-04-25
Published Print: 2014-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Ai-hua
Niu, Yi-hong
Chen, Tie-jun
Hsu, P. F.
Text and Data Mining valid from 2014-04-01