Improvement of thickness deposition uniformity in nickel electroforming for micro mold inserts
Crossref DOI link: https://doi.org/10.1007/s11771-016-3314-7
Published Online: 2016-12-22
Published Print: 2016-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jiang, Bing-yan
Weng, Can
Zhou, Ming-yong
Lv, Hui
Drummer, Dietmar
License valid from 2016-10-01