Thermal analysis of an LED module with a novelly assembled heat pipe heat sink
Crossref DOI link: https://doi.org/10.1007/s11771-017-3494-9
Published Online: 2017-05-06
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tang, Yong
Chen, Qiu
Guan, Wo-huan
Li, Zong-tao
Yu, Bin-hai
Yuan, Wei
License valid from 2017-04-01