Partial transient-liquid-phase bonding of TiC cermet to stainless steel using impulse pressuring with Ti/Cu/Nb interlayer
Crossref DOI link: https://doi.org/10.1007/s11771-018-3802-z
Published Online: 2018-05-18
Published Print: 2018-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, Li
Sheng, Guang-min
Li, Jia
Huang, Guang-jie
Yuan, Xin-jian
Text and Data Mining valid from 2018-05-01
Article History
Received: 13 October 2016
Accepted: 23 February 2017
First Online: 18 May 2018