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Surface evolution of Al-Si-Cu alloy in thermal shock under different heating speeds

Crossref DOI link: https://doi.org/10.1007/s11771-021-4836-1

Published Online: 2021-11-22

Published Print: 2021-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Liu, Lei https://orcid.org/0000-0003-3168-7303
Zhang, Hai-jun

Li, Bo-yan

Yang, Zhong

Bao, Tong

Li, Jian-ping https://orcid.org/0000-0003-4013-0603
Guo, Yong-chun

Xia, Feng

Yang, Wei

Li, Hai-ying
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Text and Data Mining valid from 2021-10-01

Version of Record valid from 2021-10-01
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Article History

Received: 9 November 2020

Accepted: 8 April 2021

First Online: 22 November 2021