Numerical investigation on interface enhancement mechanism of Ag-SnO2 contact materials with Cu additive
Crossref DOI link: https://doi.org/10.1007/s11771-022-4981-1
Published Online: 2022-04-29
Published Print: 2022-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ma, Yuan-yuan
Li, Gui-jing
Feng, Wen-jie http://orcid.org/0000-0002-5454-0091
Text and Data Mining valid from 2022-04-01
Version of Record valid from 2022-04-01
Article History
Received: 28 April 2021
Accepted: 27 July 2021
First Online: 29 April 2022