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Creep properties of bimetal Al/SiC/Cu composites fabricated via accumulative roll bonding process

Published Online: 2024-12-04

Published Print: 2024-10

Authors

Basem, Ali

Jasim, Dheyaa J.

Bansal, Pooja

Qasim, Maytham T.

Brisset, B. J. https://orcid.org/0009-0006-3735-6926
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Text and Data Mining valid from 2024-10-01

Version of Record valid from 2024-10-01
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Article History

Received: 21 November 2023

Accepted: 2 May 2024

First Online: 4 December 2024

Conflict of interest

: BASEM Ali, Jasim Dheyaa J., Bansal Pooja, Qasim Maytham T. and Brisset BJ. declare that they have no conflict of interest.

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