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Evolution mechanism of interconnect interface and shear properties of 64.8Sn35.2Pb microbump during flip chip bonding

Published Online: 2025-05-17

Published Print: 2025-04

Authors

Shen, Yu-lu

Luo, Jiao https://orcid.org/0000-0003-3734-7975
Xu, Keng-feng

Wu, Dao-wei

Zhang, Ning
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Text and Data Mining valid from 2025-04-01

Version of Record valid from 2025-04-01
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Article History

Received: 14 May 2024

Accepted: 9 December 2024

First Online: 17 May 2025

Conflict of interest

: SHEN Yu-lu, LUO Jiao, XU Keng-feng, WU Dao-wei and ZHANG Ning declare that they have no conflict of interest.

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