Copper fractal growth during recycling from waste printed circuit boards by slurry electrolysis
Crossref DOI link: https://doi.org/10.1007/s11783-021-1405-7
Published Online: 2021-03-20
Published Print: 2021-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Jiqin
Yi, Xiaoxia
Zeng, Xiangfei
Chen, Shuyuan
Wang, Rui
Shu, Jiancheng
Chen, Mengjun
Xiao, Zhengxue
Text and Data Mining valid from 2021-03-20
Version of Record valid from 2021-03-20
Article History
Received: 16 October 2020
Revised: 30 December 2020
Accepted: 31 January 2021
First Online: 20 March 2021