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Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device

Crossref DOI link: https://doi.org/10.1007/s11801-017-7048-z

Published Online: 2017-08-02

Published Print: 2017-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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