Electroless Pd deposition on a planar porous stainless steel substrate using newly developed plating rig and agitating water bath
Crossref DOI link: https://doi.org/10.1007/s11814-016-0256-6
Published Online: 2016-11-09
Published Print: 2017-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Seo, Beom-Seok
Han, Jae-Yun
Lee, Kwan-Young
Kim, Dong-Won
Ryi, Shin-Kun
License valid from 2016-11-09