Cu seed layer damage caused by insoluble anode in Cu electrodeposition
Crossref DOI link: https://doi.org/10.1007/s11814-017-0054-9
Published Online: 2017-04-10
Published Print: 2017-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ham, Yu Seok
Cho, Sung Ki
Kim, Jae Jeong
License valid from 2017-04-10