Effect of Microstructure on the Electro-Mechanical Behaviour of Cu Films on Polyimide
Crossref DOI link: https://doi.org/10.1007/s11837-016-1940-z
Published Online: 2016-05-09
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Berger, J.
Glushko, O.
Marx, V. M.
Kirchlechner, C.
Cordill, M. J.
Funding for this research was provided by:
Austrian Science Fund (0000-0003-1142-8312)
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