Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography
Crossref DOI link: https://doi.org/10.1007/s11837-016-2042-7
Published Online: 2016-07-28
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kirubanandham, A. http://orcid.org/0000-0002-8720-8941
Lujan-Regalado, I.
Vallabhaneni, R.
Chawla, N.
Funding for this research was provided by:
Semiconductor Research Corporation
License valid from 2016-07-28