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Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling

Crossref DOI link: https://doi.org/10.1007/s11837-016-2070-3

Published Online: 2016-08-18

Published Print: 2016-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chen, Wei-Hsun https://orcid.org/0000-0002-3761-1038
Sarobol, Pylin

Handwerker, Carol A. https://orcid.org/0000-0002-2660-1803
Blendell, John E.
Funding

Funding for this research was provided by:

Directorate for Mathematical and Physical Sciences

Cisco Systems

Foresite Technologies
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Text and Data Mining valid from 2016-08-18

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Article History

First Online: 18 August 2016

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