Evaluation of the Mechanical Properties of Multi-nano Layered Copper-Nickel Thin Film by the Dynamic-Nano Indentation Method
Crossref DOI link: https://doi.org/10.1007/s11837-016-2081-0
Published Online: 2016-08-24
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Choi, Yong
Funding for this research was provided by:
Dankook University (KR) (2016)
License valid from 2016-08-24