Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material
Crossref DOI link:
Update policy: https://doi.org/10.1007/SPRINGER_CROSSMARK_POLICY
Siow, K. S.
Chua, S. T.
Funding for this research was provided by:
Universiti Kebangsaan Malaysia (GUP-2017-055)
Text and Data Mining valid from 2019-04-10
14 October 2018
27 March 2019
10 April 2019