Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material
Crossref DOI link: https://doi.org/10.1007/s11837-019-03461-4
Published Online: 2019-04-10
Published Print: 2019-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Siow, K. S. http://orcid.org/0000-0003-2519-780X
Chua, S. T.
Funding for this research was provided by:
Universiti Kebangsaan Malaysia (GUP-2017-055)
Text and Data Mining valid from 2019-04-10
Article History
Received: 14 October 2018
Accepted: 27 March 2019
First Online: 10 April 2019