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Rapid Formation of Full Intermetallic Bondlines for Die Attachment in High-Temperature Power Devices Based on Micro-sized Sn-Coated Ag Particles

Published Online: 2019-06-04

Published Print: 2019-09

Authors

Yu, Fuwen

Liu, Hao

Hang, Chunjin

Chen, Hongtao https://orcid.org/0000-0003-0024-2539
Li, Mingyu
Funding

Funding for this research was provided by:

Science and Technology Project of Shenzhen (JCYJ20160318095308401)
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Text and Data Mining valid from 2019-06-04

Version of Record valid from 2019-06-04
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Article History

Received: 3 December 2018

Accepted: 22 May 2019

First Online: 4 June 2019

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